1. 2. 3. material content data sheet sales product name BSC024NE2LS issued 14. august 2015 ma# ma001015214 package pg-tdson-8-6 weight* 118.18 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.393 0.33 0.33 3322 3322 leadframe non noble metal iron 7439-89-6 0.038 0.03 320 inorganic material phosphorus 7723-14-0 0.011 0.01 96 non noble metal copper 7440-50-8 37.762 31.96 32.00 319521 319937 wire noble metal gold 7440-57-5 0.046 0.04 0.04 385 385 encapsulation organic material carbon black 1333-86-4 0.088 0.07 745 plastics epoxy resin - 6.251 5.29 52894 inorganic material silicondioxide 60676-86-0 37.683 31.89 37.25 318854 372493 leadfinish non noble metal tin 7440-31-5 1.470 1.24 1.24 12437 12437 plating noble metal silver 7440-22-4 0.166 0.14 0.14 1401 1401 solder noble metal silver 7440-22-4 0.016 0.01 131 non noble metal tin 7440-31-5 0.012 0.01 105 non noble metal lead 7439-92-1 0.592 0.50 0.52 5012 5248 heatspreader non noble metal iron 7439-89-6 0.011 0.01 96 inorganic material phosphorus 7723-14-0 0.003 0.00 29 non noble metal copper 7440-50-8 11.320 9.58 9.59 95785 95910 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 189 inorganic material phosphorus 7723-14-0 0.007 0.01 57 non noble metal copper 7440-50-8 22.292 18.86 18.89 188621 188867 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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